Advanced Packaging Solutions
As performance demands rise and form factors shrink, Advanced Packaging Solutions have become essential in modern ASIC design. These cutting-edge packaging technologies enhance integration, improve thermal management, and boost electrical performance, all while reducing the footprint. These solutions ensure that products meet both the technical and commercial needs of contemporary applications.
2.5D Packaging with Interposers
Integrating multiple dies on a silicon interposer for high-bandwidth communication with reduced power consumption.
Fan-Out Wafer-Level Packaging (FO-WLP)
Extending I/O to a larger footprint, delivering high performance in a compact package.
Flip-Chip Packaging
Implementing flip-chip technology for high-performance interconnects, ensuring enhanced signal integrity, thermal efficiency, and optimized power delivery.
Wafer-Level Chip-Scale Packaging (WLCSP)
Minimizing the form factor, making it ideal for space-constrained applications such as IoT and mobile devices.
Package Simulation, Testing, and Qualification
Conducting simulations and rigorous testing to validate thermal, mechanical, and electrical performance.
3D Integrated Circuit (3D-IC) Packaging
Utilizing 3D-IC technology to vertically stack dies, enabling unprecedented integration density and performance.
System-in-Package (SiP) Solutions
Integrating multiple components within a single package, streamlining communication and reducing system size.
Wire Bonding Packaging
Providing cost-effective wire bonding solutions, ideal for lower-power designs requiring reliable connections.
Thermal and Power Management Solutions
Employing advanced thermal dissipation and power management techniques to ensure reliable operation under high-power conditions.